• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    An electroluminescent device comprises: a semiconductor laser element (10); a support member (40) located above the laser element (10) having a through hole which allows light emitted from the laser element (10) to pass; a fluorescent element (50) located in the hole containing a fluorescent material which can be excited by the light emitted by the laser element (10) so as to emit light having a wavelength different from that emitted by the laser element (10); and a light transmitting heat dissipating member (60) comprising: a base portion, and a projection protruding from the base portion into the hole. An upper surface of the protrusion is bonded to a lower surface of the fluorescent element (50). An upper surface of the base portion is bonded to a lower surface of the support member (40).
    公开号:FR3051887A1
    申请号:FR1754795
    申请日:2017-05-31
    公开日:2017-12-01
    发明作者:Toshiaki Yamashita
    申请人:Nichia Corp；
    IPC主号:
    专利说明:

    DEVICE WITH ELECTROLUMINESCENT REFERENCE CROSSED TO A RELATED APPLICATION
    This application includes a priority claim based on Japanese Patent Application No. 2016-109252, filed May 31, 2016.
    CONTEXT
    The present disclosure relates to a light emitting device.
    A semiconductor light emitting device configured to extract light emitted from a semiconductor light emitting element through a light extraction window onto which a light transmitting film is attached has been described (see the publication of unexamined Japanese patent application η "Η11-087778). The light-transmitting film is coated with a fluorescent substance. Alternatively, fluorescers are dispersed in the light transmitting film (see paragraph 0255 in Japanese Unexamined Patent Application Publication No. H11-087778).
    ABSTRACT
    During the operation of a solid-state light-emitting device, a fluorescent substance is irradiated with the light from the semiconductor light-emitting element, which allows the fluorescent substance to generate heat. Conventional semiconductor electroluminescent devices may not have a structure that takes into consideration this generation of heat, and therefore these semiconductor light emitting devices may not achieve a higher efficiency.
    The subject of the invention is an electroluminescent device comprising: a semiconductor laser element; a support member located above the semiconductor laser element, the support member having a through hole which allows light emitted from the semiconductor laser element to pass through through this one; a fluorescent element located in the through-hole, the fluorescent element containing a fluorescent material which can be excited by the light emitted from the semiconductor laser element so as to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element; and - a light transmitting heat dissipating element comprising a base portion and a projection protruding from the base portion into the through hole; wherein the through hole is tapered to widen in an upward direction, wherein an upper surface of the protruding portion of the heat dissipating member is bonded to a lower surface of the fluorescent member and wherein an upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the support member.
    The electroluminescent device according to the invention may comprise one or more of the following features: it furthermore comprises a part with a low refractive index having a refractive index less than a refractive index of the fluorescent element, the low-index part. refraction being present in the through hole on a lateral side of the fluorescent element; the low refractive index portion is a space filled with air; the fluorescent element comprises a first fluorescent element bonded to the upper surface of the projecting portion and a second fluorescent element having a lateral surface supported by an inner wall of the through hole and a lower surface comprising a portion bonded to the first fluorescent element and in wherein the low-refractive portion is present on a lateral side of the first fluorescent element; the semiconductor laser element is designed to emit blue light, the first fluorescent element contains a fluorescent material designed to emit yellow light and the second fluorescent element contains a fluorescent material designed to emit red light; the first fluorescent element comprises a ceramic containing a fluorescent material; the second fluorescent element comprises a glass containing a fluorescent material; it further comprises an enclosure element surrounding the semiconductor laser element and having an aperture which allows light emitted from the semiconductor laser element to pass therethrough in wherein the lower surface of the support member is bonded to an upper surface of the enclosure member through the heat dissipating member; the upper surface of the base portion of the heat dissipating element comprises a plurality of projections at a region where the upper surface of the base portion of the heat dissipating element is connected to the lower surface of the support member; an upper surface of the fluorescent element and an upper surface of the support element are in a common plane.
    In one embodiment, an electroluminescent device includes a semiconductor laser element, a support member located above the semiconductor laser element, the support member having a through hole that enables the light emitted from the semiconductor laser element passing therethrough, a fluorescent element located in the through-hole, the fluorescent element containing a fluorescent material which can be excited by light emitted from the semiconductor laser element to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element, and an element heat-dissipating light-transmitting apparatus comprising a base portion and a protruding portion which protrudes from the base portion into the through-hole, the through-hole is tapered such that it expands in an upward direction, an upper surface of the protruding portion of the heat dissipating element bonded to a lower surface of the fluorescent element, and an upper surface of the base of the heat dissipating element bonded to a lower surface of the support member.
    With the above configuration, the heat dissipation from a fluorescent element and the light extraction efficiency of a light emitting device can both be improved, so that a high efficiency of the electroluminescent device can effectively be obtained.
    BRIEF DESCRIPTION OF THE DRAWINGS
    Figure 1A is a schematic sectional view of an electroluminescent device according to a first embodiment.
    Fig. 1B is an enlarged schematic view of a support member, a fluorescent element and a heat dissipating member of Fig. 1A.
    Figure 2A is a schematic sectional view of an electroluminescent device according to a second embodiment.
    Fig. 2B is an enlarged schematic view of a support member, the fluorescent element and a heat dissipating member of Fig. 2A.
    Figure 3A is a schematic sectional view of an electroluminescent device according to a third embodiment.
    Fig. 3B is an enlarged schematic view of the support member, a fluorescent element, and the heat sink element of Fig. 3A.
    DETAILED DESCRIPTION
    Electroluminescent device 1 according to a first embodiment
    Figure IA is a schematic sectional view of a light emitting device 1 according to a first embodiment. Fig. 1B is an enlarged schematic view of a support member 40, a fluorescent element 50, and a heat sink 60 of Fig. 1A. As shown in Fig. 1A and Fig. 1B, the light emitting device 1 comprises a semiconductor laser element 10, the support member 40, the fluorescent element 50, and the light-transmitting heat dissipating element 60. The support member 40 is disposed above the semiconductor laser element 10 and defines a through hole Y which allows light emitted from the semiconductor laser element 10 to pass through. through this one. The fluorescent element 50 is disposed in the through hole Y and contains a fluorescent material which is excited by the light from the semiconductor laser element 10 and emits light having a wavelength different from the length of the light. wave of light from the semiconductor laser element 10 during excitation. The heat dissipating member 60 includes a base portion 62 and a protrusion 64 that protrude from the base portion 62 into the through hole Y. The through hole Y widens upwardly. The upper surface of the projecting portion 64 of the heat dissipating element 60 is bonded to the lower surface of the fluorescent element 50. The upper surface of the base portion 62 of the heat dissipating element 60 is bonded to at a lower surface of the support member 40.
    With the present embodiment, the heat dissipation from the fluorescent element 50 and the light extraction efficiency of the light emitting device 1 can both be improved so that a high efficiency of the electroluminescent device 1 can effectively be achieved. obtained. That is, improving the heat dissipation from the fluorescent element 50 allows irradiation of the fluorescent element 50 with more intense light, so that the output of the light emitting device 1 can to be improved. In addition, improving the light extraction efficiency of the light-emitting device 1 makes it possible to increase the amount of light extracted from the light-emitting device 1, so that the output of the light-emitting device 1 can be improved. Therefore, a higher efficiency of the light emitting device 1 can actually be achieved by improving both the heat dissipation from the fluorescent element 50 and the light extraction efficiency of the light emitting device 1. Further details will be described below.
    Semiconductor laser element 10
    For the semiconductor laser element 10, for example, a semiconductor laser element having a peak laser emission wavelength in a range of 420 nm to 470 nm may be used. Improving the heat dissipation from the fluorescent element 50 as in the present embodiment allows the light-emitting device 1 to operate with stable optical properties even in the case where the fluorescent element 50 is irradiated with a light. a high power laser having a power, for example, of 2.0 W or more, preferably in a range of 2.0 W to 5.0 W. The semiconductor laser element 10 is disposed laterally with respect to a heat sink 20. For the heat sink 20, a material with good thermal conductivity, such as copper, aluminum and brass, is preferably used so that the heat dissipation from the fluorescent element 50 can be further improved. The heat sink 20 is attached to a plate-shaped rod 21. The semiconductor laser element 10 is electrically connected to conductive terminals 22 via electrically conductive elements such as wires.
    Speaker element 30
    An enclosure member 30 surrounds the semiconductor laser element 10 and defines an aperture X through which light emitted from the semiconductor laser element 10 can pass. The lower surface of the heat dissipating element 60 is in contact with the upper surface of the enclosure element 30, and the lower surface of the support element 40 is bonded to the upper surface of the heating element. enclosure 30 through heat sink 60. A heat dissipation path that allows heat from support member 40 to be transferred to heat sink 60 and further to the enclosure member 30 is provided, so that the heat dissipation from the fluorescent element 50 is further enhanced. A material such as stainless steel and Kovar® (ferrous nickel-cobalt alloy) can be used for the enclosure element 30.
    Support member 40 The support member 40 is disposed above the semiconductor laser element 10. For the support member 40, for example, a ceramic with a high reflectance, or a metallic element comprising a reflective film on the inner wall of the through hole Y can be used. The use of such a material as a support member 40 facilitates the reflection of light from the fluorescent element 50 on the inner wall of the through hole Y, so that the light extraction efficiency of the electroluminescent device 1 can be improved. The support member 40 defines the through hole Y through which light from the semiconductor laser element 10 can pass. The through hole Y has a shape in which a width increases upwards. With such a shape, for example, some of the light that has been reflected in the fluorescent element 50 can be easily reflected upwardly by the inner wall of the through hole Y, so that the light extraction efficiency of the Electroluminescent device 1 can be further improved.
    Fluorescent element 50 The fluorescent element 50 is disposed in the through hole Y. Thus, the inner wall of the through hole Y is located on a lateral side of the fluorescent element 50. With the inner wall of the through hole Y located a lateral side of the fluorescent element 50, the light from the fluorescent element 50 can be reflected on the inner wall of the through hole Y, which improves the light extraction efficiency of the electroluminescent device 1. The fluorescent element 50 contains the fluorescent material to be excited by the light emitted from the semiconductor laser element 10 and to emit light having a wavelength different from the wavelength of the light emitted from the semiconductor laser element 10. More specifically, for example, an element containing the fluorescent material in a base element such as a body It consists of a ceramic-based material and a light-transmitting resin can be used for the fluorescent element 50. In particular, the use of a ceramic sintered body as a base element allows for to reduce the deformation of the fluorescent element 50 due to the heat generated by the fluorescent material, so that the optical properties of the light emitting device 1 can be stabilized. As a result, the fluorescent element 50 can be irradiated with even more intense light, thereby effectively obtaining a higher efficiency of the electroluminescent device 1. Examples of the ceramic-based material include aluminum oxide ( Al 2 O 3), zirconium oxide (ZrO 2) and titanium oxide (TiO 2).
    Examples of the fluorescent material include yttrium and aluminum garnet fluorescent materials (YAG fluorescent materials), lutetium and aluminum garnet fluorescent materials (LAG fluorescent materials), terbium garnet fluorescent materials, and fluorescent materials. aluminum (TAG fluorescent materials), and SiAION fluorescent materials. These materials can be used alone or in combination. The fluorescent element 50 may contain a light-scattering element such as silicon oxide (SiO 2), aluminum oxide (Al 2 O 3), zirconium oxide (ZrO 2), or titanium oxide ( Ti02). With the fluorescent element 50 containing the light scattering element, the light emitted from the semiconductor laser element 10 can be diffused in the fluorescent element 50, so that the non-uniformity of the color light extracted from the light-emitting device 1 can be reduced. The light scattering element has, for example, a granular shape.
    Heat dissipating member 60 The heat dissipating member 60 includes the base portion 62 and the projecting portion 64 which protrudes from the base portion 62 into the through hole Y and transmits light from the laser member Semiconductor 10. Sapphire and magnesia, which have a light transmitting property, may be used for the heat dissipating element 60. The sapphire, which has a relatively high heat dissipation performance, is preferably used. The heat dissipating member 60 may have a thickness in a range of about 200 μm to 1000 μm. With the thickness of the heat dissipating member 60 of 200 μm or more, the heat dissipation performance of the heat dissipating member 60 can be improved, so that the heat dissipation from the Fluorescent element 50 can be further improved. With the thickness of the heat dissipating member 60 of 1000 μm or less, the lateral propagation of light through the heat dissipating member 60 can be reduced, so that the light extraction efficiency of the Electroluminescent device 1 can be further improved.
    The upper surface of the projecting portion 64 is bonded to the lower surface of the fluorescent element 50. The base portion 62 is bonded to the lower surface of the support member 40. Here, the bonding surface between the upper surface of the projecting portion 64 and the lower surface of the fluorescent element 50 is called the first bonding surface A, and the bonding surface between the base portion 62 and the lower surface of the support member 40 is called the second surface of the link B. As described above, with a heat dissipation path (heat dissipation path through the first bonding surface A) through which heat from the fluorescent element 50 is directly transferred to the element heat dissipation 60 and a heat dissipation path (heat dissipation path through the second bonding surface B) through which heat from the The fluorescent element 50 is indirectly transferred to the heat dissipating element 60 through the support member 40, the heat dissipation from the fluorescent element 50 can be improved. The lower surface of the fluorescent element 50 particularly easily generates heat because it is irradiated with the light emitted from the semiconductor laser element 10, and thus the heat dissipation path prediction. through the first bonding surface A effectively improves the heat dissipation from the fluorescent element 50.
    In the present embodiment, the heat dissipating member 60 includes the projecting portion 64, and the upper surface of the projecting portion 64 is bonded to the lower surface of the fluorescent element 50. With this arrangement, the light becomes visible. propagating downwards from the fluorescent element 50 is more easily reflected by the inner wall of the through-hole Y than in the case where the heat dissipating element 60 is flat, and a part of the light reflected on the wall Inside the through hole Y is more likely to propagate upwards. In the present embodiment, the light extraction efficiency of the light emitting device 1 can be increased in this manner.
    A dielectric multilayer film which reflects light in a specific wavelength range may be disposed on the lower surface of the heat sink 60 to improve the light extraction efficiency of the light emitting device 1. For example, a film for transmitting light in a wavelength range of light emitted from the semiconductor laser element 10 and for reflecting light in a wavelength range of light emitted from the fluorescent element 50 may be used for the dielectric multilayer film. With such a dielectric multilayer film on the lower surface of the heat dissipating element 60, the light propagating towards the lower surface of the heat dissipating element 60 can be reflected upwardly in the through hole Y. By therefore, the light extraction efficiency of the light emitting device 1 can be further improved.
    Electroluminescent device 2 according to a second embodiment
    Figure 2A is a schematic sectional view of an electroluminescent device 2 according to a second embodiment.
    Fig. 2B is an enlarged schematic view of a support member 40, fluorescent element 50, and a heat sink 60 of Fig. TA. As shown in FIG. 2B and FIG. 2B, the electroluminescent device 2 differs from the light emitting device 1 according to the first embodiment in that the second connecting surface B of the light emitting device 2 has an irregularity in sectional view, while the second connecting surface B of the electroluminescent device 1 according to the first embodiment has a substantially linear geometry in sectional view. In the second embodiment, the bonding area (i.e., the area of the second bonding surface B) between the base portion 62 and the lower surface of the support member 40 can be enlarged. compared to the case where the second connecting surface B has a linear geometry in sectional view. Therefore, the heat can be released more efficiently through the heat dissipation path (heat dissipation path through the second bonding surface B) through which heat from the fluorescent element 50 is transferred indirectly to the heat sink. heat dissipating element 60 through the support member 40, so that the heat dissipation from the fluorescent element 50 can be further improved.
    Electroluminescent device 3 according to a third embodiment
    Figure 3A is a schematic sectional view of an electroluminescent device 3 according to a third embodiment.
    Fig. 3B is an enlarged schematic view of the support member 40, a fluorescent element 50, and the heat sink 60 of Fig. 3A. As shown in FIG. 3A and FIG. 3B, the electroluminescent device 3 differs from the electroluminescent device 1 according to the first embodiment in that the fluorescent element 50 comprises a first fluorescent element 52 linked to the upper surface of the projecting portion 64 and a second fluorescent element 54 having a side surface supported by the inner wall of the through hole Y and having a lower surface which includes a portion bonded to the first fluorescent element 52. Furthermore, the electroluminescent device 3 differs from the electroluminescent device 1 in that that a low refractive index portion 70 having a refractive index lower than the refractive index of the first fluorescent element 52 is present on a lateral side of the first fluorescent element 52, in the through hole Y. The low-energy portion refractive index 70 has a refractive index lower than the indic e of refraction of the first fluorescent element 52, preferably lower than both the refractive index of the support element 40 and the refractive index of the first fluorescent element 52. The refractive index of the first fluorescent element Here is the refractive index of a primarily exposed element on the surface of the fluorescent element 52. The low refractive index portion 70 is preferably, for example, air.
    With the low refractive index portion 70 having a refractive index lower than the refractive index of the first fluorescent element 52 on a lateral side of the first fluorescent element 52, the total reflection on the interface between the first fluorescent element 52 and the low refractive index portion 70 can be facilitated. As a result, the light propagating from the interior of the first fluorescent element 52 to the inner wall of the through hole Y can be reduced, so that the light extraction efficiency of the light emitting device 1 can be further improved. In the case where a ceramic material or the like is used for the support member 40, the low refractive index portion 70 preferably has a refractive index even lower than the refractive index of the refractive element. With this arrangement, the inner wall of the through-hole Y allows light propagating from the low-refractive portion 70 to be reflected back to the support member 40. Therefore, the light entering the support member 40 may be reduced, so that light leakage from the light-emitting device 1 may be further reduced.
    The present embodiment may preferably be applied in the case where the support member 40 is made of an element having a relatively low reflectance, such as a ceramic-based material, and may also preferably be applied. in the case where the support member 40 consists of an element having a relatively large reflectance, such as a metallic material. That is, a metallic material has a reflectance greater than the reflectance of a ceramic, but a surface of the metallic material readily absorbs light in the case where the fluorescent element 50 is in contact with the metallic material , unlike the case where the fluorescent element 50 is spaced from the metallic material. However, even in this case, with the low refractive index portion 70 having a refractive index lower than the refractive index of the support member 40, a decrease in the light extraction efficiency of the light emitting device 1 may to be avoided.
    In the present embodiment, the low refractive index portion 70 is present on a lateral side of the first fluorescent element 52, the lateral surface of the second fluorescent element 54 is bonded to the inner wall of the through hole Y, and a portion the lower surface of the second fluorescent element 54 is bonded to the upper surface of the first fluorescent element. With this arrangement, the first fluorescent element 52 can be attached between the lower surface of the second fluorescent element 54 and the upper surface of the heat dissipating element 60. Therefore, even in the case where the first fluorescent element 52 has a high melting point and is thus difficult to melt bond to the inner wall of the through hole Y, the attachment of the second fluorescent element 54 to the inner wall of the through hole Y by fusion bonding allows the first fluorescent element 52 is disposed in the through hole Y.
    A ceramic containing a fluorescent material is preferably used for the first fluorescent element 52, and a glass containing a fluorescent material is preferably used for the second fluorescent element 54. With this constitution, the first fluorescent element 52 and the second fluorescent element 54 can be fixed by arranging the second fluorescent element 54 above the first fluorescent element 52 and melt bonding the second fluorescent element 54 to the upper surface of the first fluorescent element 52 and to the inner wall of the through hole Y. In addition, the use of a ceramic containing a fluorescent material, which has a good heat resistance, for the first fluorescent element 52, which is initially irradiated with the light from the semiconductor laser element 10, allows that the second fluorescent element 54 contains a fluorescent material having, For example, low heat resistance. In the fusion bond, the first fluorescent element 52 and the second fluorescent element 54 are heated to a temperature at which the second glass-containing fluorescent element 54 is melted to a degree that allows fusion bonding and the first fluorescent element 52 containing a ceramic is not fused to a degree that allows fusion bonding. The heating is effected, for example, at about 850 ° C. Running the heater at this temperature allows the first fluorescent element 52 and the second fluorescent element 54 to be fixed in the through hole Y while reducing damage to the fluorescent materials due to heat.
    The first fluorescent element 52 may contain a fluorescent material that emits light having a wavelength different from that of the light emitted from a fluorescent material of the second fluorescent element 54. With this arrangement, the color of the light extracted of the electroluminescent device 3 can be adjusted. For example, using a semiconductor laser element to emit blue light for the semiconductor laser element 10, a fluorescent element containing a fluorescent material which emits yellow light for the first fluorescent element 52 and a fluorescent element containing a fluorescent material which emits a red light for the second fluorescent element 54, a white light can be extracted from the electroluminescent device 3.
    The first to third embodiments have been described above, but the present invention is not limited to the described embodiments.
    权利要求:
    Claims (10)
    [1" id="c-fr-0001]
    An electroluminescent device comprising: a semiconductor laser element (10); a support member (40) located above the semiconductor laser element (10), the support member (40) having a through hole (Y) which allows light emitted from the semiconductor laser element (10) to pass therethrough; a fluorescent element (50) in the through-hole (Y), the fluorescent element (50) containing a fluorescent material which can be excited by the light emitted from the semiconductor laser element to emit light having a wavelength different from a wavelength of the light emitted from the semiconductor laser element (10); and a light transmitting heat dissipating member (60) comprising: a base portion (62), and a projection (64) projecting from the base portion (62) into the through hole; wherein the through hole (Y) is tapered to widen in an upward direction, wherein an upper surface of the protruding portion of the heat dissipating member is bonded to a lower surface of the element fluorescent, and wherein an upper surface of the base portion of the heat dissipating member is bonded to a lower surface of the support member.
    [2" id="c-fr-0002]
    An electroluminescent device according to claim 1, further comprising a low refractive index portion (70) having a refractive index less than a refractive index of the fluorescent element (50), the low refractive index portion being present in the through-hole (Y) on a lateral side of the fluorescent element (50).
    [3" id="c-fr-0003]
    The electroluminescent device of claim 2, wherein the low refractive index portion (70) is a space filled with air.
    [4" id="c-fr-0004]
    An electroluminescent device according to claim 2 or 3, wherein the fluorescent element (50) comprises: a first fluorescent element (52) bonded to the upper surface of the protrusion (64); and a second fluorescent element (54) having: a lateral surface supported by an inner wall of the through-hole (Y), and a lower surface including a portion bonded to the first fluorescent element (52), and wherein the low-index portion refraction (70) is present on a lateral side of the first fluorescent element (52).
    [5" id="c-fr-0005]
    An electroluminescent device according to claim 4, wherein: the semiconductor laser element (10) is adapted to emit blue light, the first fluorescent element (52) contains a fluorescent material designed to emit yellow light, and the second fluorescent element (54) contains a fluorescent material designed to emit a red light.
    [6" id="c-fr-0006]
    An electroluminescent device according to any of claims 4 and 5, wherein the first fluorescent element (52) comprises a ceramic containing a fluorescent material.
    [7" id="c-fr-0007]
    The electroluminescent device according to any one of claims 4 to 6, wherein the second fluorescent element (54) comprises a glass containing a fluorescent material.
    [8" id="c-fr-0008]
    An electroluminescent device according to any one of claims 1 to 7, further comprising: an enclosure member (30) surrounding the semiconductor laser element (10) and having an opening which allows the emitted light from the semiconductor laser element (10) to pass therethrough, wherein the lower surface of the support member (40) is bonded to an upper surface of the enclosure member (30) via the heat dissipating element (60).
    [9" id="c-fr-0009]
    The electroluminescent device according to any of claims 1 to 8, wherein the upper surface of the base portion (62) of the heat dissipating member (60) comprises a plurality of projecting portions at a wherein the upper surface of the base portion (62) of the heat dissipating member (60) is bonded to the lower surface of the support member (40).
    [10" id="c-fr-0010]
    The electroluminescent device according to any one of claims 1 to 9, wherein an upper surface of the fluorescent element (50) and an upper surface of the support element are in a common plane.
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    法律状态:
    2018-03-19| PLFP| Fee payment|Year of fee payment: 2 |
    2019-03-29| PLFP| Fee payment|Year of fee payment: 3 |
    2020-04-14| PLFP| Fee payment|Year of fee payment: 4 |
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    优先权:
    申请号 | 申请日 | 专利标题
    JP2016109252|2016-05-31|
    JP2016109252A|JP6493308B2|2016-05-31|2016-05-31|Light emitting device|
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